Fundamental Studies in Cryogenic Cooling of Power Electronics.
Abstract
This report is divided into two studies. The first deals with the measurement and modeling of film thickness produced during spray cooling. The experiments were conducted using pressure and air atomizing nozzles. The film thickness increases with decrease in flow rate for pressure atomizing nozzles, although the decrease is small. For air atomizing nozzles, increase in flow rate causes an increase in film thickness while and increase in air velocity causes a decrease in film thickness. Models were derived for both forms of sprays. The second study deals with the effect of operating temperature and cooling technique on power MOSFET characteristics. This numerical study found that the maximum drain current can be more than quadrupled at 78 K as compared to room temperature operation. In comparing spray cooling and immersion cooling, it was found that the maximum drain current possible with spray cooling was more than double that with immersion cooling.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1996
- Accession Number
- ADA321216
Entities
People
- L. C. Chow
- M. S. Sehmbey
- X. Q. Chen
Organizations
- University of Kentucky