Advanced Composite Solders for Microelectronics. Phase 2.

Abstract

The objectives of the Phase 2 work were (1) Increase solder powder production capacity of the RPM production facility from 10 lb/batch to 500 lbs/batch for the production of conventional 63 Sn-37 Pb solder powders, ternary and quaternary 63Sn-37 Pb-X( X=Ni,Cu,Ag,Sb,In or Bi) solder powders, and lead free Sn-based solder powders; and (2) Perform a comprehensive study of the physical, mechanical and solderability/wettability properties of the solder powders.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1997
Accession Number
ADA321560

Tags

Communities of Interest

  • Advanced Electronics
  • Biomedical
  • Space

DTIC Thesaurus Topics

  • Creep
  • Creep Tests
  • Fabrication
  • Fatigue Tests (Mechanics)
  • Geometry
  • Manufacturing
  • Materials
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Melting Point
  • Production
  • Solid Solutions
  • Tensile Properties
  • Tensile Strength
  • Tensile Testing
  • Test And Evaluation

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Powder metallurgy of Titanium alloys.
  • Software Engineering

Technology Areas

  • Microelectronics