Microelectronic Radiation Hardening Process and Design Development, Test, and Evaluation.

Abstract

Radiation induced charge trapping versus Buried Oxide (BOX) thickness on various Separation by Implantation (SIMOX) buried oxides has been determined. An inflection point has been observed in the voltage shift vs. buried oxide thickness relationship. As such, the radiation induced voltage shifts for thin buried oxides are greater than what could be expected from a simple square law relationship. These results can be explained by the location and magnitude of the radiation induced oxide charge centroid and its relationship to the BOX thickness. The location of the centroid for trapped positive charge is dependent on the radiation induced hole mobility, which is related to SIMOX processing as well as on geometry and charge saturation. Photoinjection was used to study the charge trapping properties of high temperature oxidation (HITOX) SIMOX buried oxides, provided by two independent vendors. After electron injection, the electron trapping per area for both HITOX material sources was found to be larger than their respective standard (control) SIMOX structures. Photo Injection, Buried Oxide, Oxide Charge Centroid, Electron Capture Cross Section, High Temperature Oxidation, Separation by Implantation of Oxygen.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1997
Accession Number
ADA322246

Entities

People

  • Akos Revesz
  • Patrick Mcmarr
  • Reek Lawrence

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Electron Capture
  • Electrons
  • Geometry
  • Hardening
  • High Temperature
  • Implantation
  • Oxidation
  • Oxides
  • Radiation
  • Radiation Hardening
  • Thickness

Fields of Study

  • Physics

Readers

  • Approximation Theory.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene