A New Technique for the Simultaneous Measurement of Thermal Diffusivity and Thermal Conductivity of Small Energetic-Material Specimens.

Abstract

An experimental technique to simultaneously measure the thermal diffusivity and thermal conductivity of small specimens of thermal-insulator materials is described. Experimental conditions that approach the mathematical idealization of a one-dimensional, infinite, two-component, composite solid whose planar interface is subjected to a step-function heat flux are developed. The heat flux is generated by resistive heating of a thin metallic foil. Although this principle has been exploited previously, the present technique permits specimens with volumes two orders of magnitude smaller than prior work based on the same idealization. A number of difficulties related to small specimen volume are identified and overcome. Another improvement over past efforts is the use of nonlinear least squares analysis to determine the optimum values for diffusivity and conductivity. A comparison of measurements of these properties for acrylic and Pyrex glass with literature values suggests that the technique affords accuracies of about 5% for materials in this range.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1997
Accession Number
ADA322889

Entities

People

  • Anthony J. Kotlar
  • Martin S. Miller

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Accuracy
  • Chemistry
  • Composite Materials
  • Conductivity
  • Energetic Materials
  • Heat Flux
  • Jet Propulsion
  • Materials
  • Materials Laboratories
  • Materials Science
  • Measurement
  • Military Research
  • Silica Glass
  • Step Functions
  • Temperature Gradients
  • Thermal Conductivity
  • Thermal Diffusivity

Readers

  • Electromagnetic Wave Scattering and Antenna Radiation Engineering
  • Structural Health Monitoring of Composite Structures.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics