Semiconductor Packaging: A DoD Dual Use Technology Assessment.

Abstract

This assessment concludes that commercial capabilities for single-chip semiconductor packaging are sufficient to assure affordable access to meet military needs, and no action is required by the Department of Defense (DoD). Driven by markets in telecommunications, computers, consumer electronics, and automotive systems, the integrated circuit (IC) packaging industry is able to provide the mainstream packaging technology required by the DoD. Although predominantly offshore, IC assemblers and equipment suppliers are highly competitive and diversified. Packaging materials suppliers are concentrated in Japan, but there has been no indication that access to materials will be limited or denied.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1995
Accession Number
ADA324633

Entities

Organizations

  • United States Department of Defense

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Application-Specific Integrated Circuits
  • Circuit Boards
  • Circuit Testers
  • Electronics Industry
  • Electronics Laboratories
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Manufacturing
  • Materials Processing
  • Materials Science
  • Modules (Electronics)
  • Monolithic Microwave Integrated Circuits
  • National Security
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Three Dimensional

Readers

  • Industrial Economics
  • Integrated Circuit Design and Technology.
  • Strategic Security Studies

Technology Areas

  • Microelectronics