Development of Hot Melt Flexible Polyimide Sealants for Rapid Sealing of Aircraft and Missiles,

Abstract

Studies were conducted on a baseline hot-melt flexible polyimide formulation developed on a previous NADC contract for potential application as a quick-fix field repair sealant for Navy aircraft and missiles. The baseline formulation was 1.0:0.5:0.6 by mol methylenedianiline (MDA) :bismaleimidophenylmethane (BMPM) :Jeffamine ED-900 bismaleimide (BMJ900). Studies consisted of Task I - Flexible Polyimide Optimization & Scale-up - and Task II - Resin Compounding & Hot Melt Tool Development - and III - Finalize Sealant Evaluation Studies. Different variations of filled and compounded formulations were prepared and examined for solvent, water immersion, and humidity stability. Efforts were conducted to prepare a formulation suitable for extrusion through a commercially available hot-melt sealant applicator. No one resin was found to meet the program goal requirements. Because of this, Task IV - Field Demonstration - was not performed, with concurrence of the NADC Technical Monitor.

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Document Details

Document Type
Technical Report
Publication Date
Sep 30, 1984
Accession Number
ADA325850

Entities

People

  • Glenn E. Chang

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Aircrafts
  • Applicators
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Cleaning Compounds
  • Contracts
  • Demonstrations
  • Extrusion
  • Failure Mode And Effect Analysis
  • High Temperature
  • Humidity
  • Low Temperature
  • Materials
  • Navy Aircraft
  • Optimization

Readers

  • Polymer Science and Engineering.
  • Software Engineering