Thermal Stress in Thin Films and Interconnects.

Abstract

The two dimensional closed system of partial differential equations and boundary conditions were derived with respect to thermal stresses in thin films and bonding layers of electronics for an arbitrary shape of a film/layer in plan view. Both thermoelastic materials with arbitrary temperature dependent constants and ideally thermoplastic materials were studied. Analytical solutions based on boundary layer philosophy were constructed, and the numerical code for thermal stresses in thin films and bonding layers was suggested.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1995
Accession Number
ADA326178

Entities

People

  • Genady P. Cherepanov

Organizations

  • Florida International University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Boundary Layer
  • Boundary Value Problems
  • Composite Materials
  • Differential Equations
  • Elastic Properties
  • Electronics
  • Equations
  • Materials
  • Materials Science
  • Mechanics
  • Partial Differential Equations
  • Shear Modulus
  • Shear Stresses
  • Thin Films
  • Three Dimensional
  • Two Dimensional

Readers

  • Calculus or Mathematical Analysis
  • Structural Health Monitoring of Composite Structures.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene