Ceramic/Metal Composite Circuit-Board Level Technology for Application Specific Electronic Modules (ASEMs).

Abstract

The quarterly progress for the Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Technology Transfer to Merchant Suppliers, and Fabrication and Testing of Technology Demonstration Modules.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1997
Accession Number
ADA326272

Entities

People

  • B. J. Thaler

Organizations

  • Sarnoff Corporation

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Amplifiers
  • Assembly
  • C Band
  • Circuit Boards
  • Composite Materials
  • Demonstrations
  • Electronics
  • Fabrication
  • Failure Mode And Effect Analysis
  • Inverters
  • Materials
  • Materials Processing
  • Metal Matrix Composites
  • Power Amplifiers
  • Power Electronics
  • Technology Transfer
  • Test And Evaluation

Readers

  • Small Business Innovation Research Program (SBIR) EDI Research and Innovation.
  • Software Engineering

Technology Areas

  • Microelectronics