Holographic Optical Interconnects for Multichip Modules.
Abstract
For the past few years we have been working on the development of an optically interconnected Multichip Module (MCM). The MCM is composed of a planar transparent substrate, containing thin film electrical connections. GaAs laser array chips and silicon CMOS VLSI chips with integrated photodetectors are flip-chip bonded to one side of the substrate, while Computer Generated Holograms (CGHs) are fabricated on the other side of the substrate. The purpose of this work is to develop the technology to enable high speed and high density connections between chips, MCMs and PC boards. We believe that the basic approach and based on flip-chip and CGH technology will provide 1-2 orders of magnitude increase in connection performance when compared with conventional electrical connectors.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 19, 1997
- Accession Number
- ADA326540
Entities
People
- Michael R. Feldman
Organizations
- University of North Carolina at Charlotte