Thermal Management Research Studies. Volume 1. Electronics Cooling.

Abstract

An innovative cooling concept called 'venturi flow cooling' has been introduced and developed for potential use in the thermal management of the advanced high power electronic devices. Single phase cooling medium is effectively used to create very high velocities in localized region of interest to improve heat transfer. Several different test apparatus have been built to investigate the heat transfer and flow phenomena. Using the venturi flow system and water, power devices, such as MCT and IGBT, were successfully tested at their rated current and frequency levels never possible with other cooling methods. Heat flux up to 257 W/(sq. cm) and heat transfer coefficient up to 13 W/(sq. cm). deg C were demonstrated in this cooling system. This cooling technique is highly recommended for the future electronic cooling applications of the emerging more electric airplane systems involving very high intensity localized heat dissipation devices. This report presents the detailed descriptions of all aspects of this project.

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Document Details

Document Type
Technical Report
Publication Date
Nov 18, 1996
Accession Number
ADA326973

Entities

People

  • Rengasamy Ponnappan

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Aircrafts
  • Airplanes
  • Coefficients
  • Computational Fluid Dynamics
  • Dissipation
  • Electronics
  • Frequency
  • Heat Flux
  • Heat Transfer
  • Heat Transfer Coefficients
  • Intensity
  • Temperature Control

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Nanoscale Plasmonic Nanotechnology
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics