Methodology, Tools and Demonstration of MCM System Optimization

Abstract

Thin film/solder-bump packaging can be used to improve integrated circuit performance and cost. In this project we (1) designed and built a DES chip to demonstrate the advantages and (2) developed design methodology to support this design style, including appropriate CAD tools.

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Document Details

Document Type
Technical Report
Publication Date
Jul 31, 1997
Accession Number
ADA328732

Entities

People

  • Paul D Franzon

Organizations

  • North Carolina State University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Abstracts
  • Circuits
  • Data Encryption
  • Demonstrations
  • Electronics
  • Films
  • Flip Chips
  • Integrated Circuits
  • Military Research
  • Multichip Modules
  • North Carolina
  • Optimization
  • Packaging
  • Scientists
  • Standards
  • Technology Transfer
  • Thin Films

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering.