Thermal Analysis of Multichip Modules Using Domain Decomposition and Wavelet-Capacitance Matrix

Abstract

Computational technology base for the solution of the initial value problem for 2-dimensional heat diffusion equation in a finite, composite multidimensional region has been developed. This is the first step toward creating a software design tool whose purpose is to accurately predict reliability and durability of multichip module designs. Singularities arising from material interfaces have been resolved by the multi resolution analysis based on wavelet-Galerkin method. Implementation strategies used for the wavelet-Galerkin method are: domain decomposition for partitioned and distributed computations; incorporating local and global data symmetries in all stages of the computations for reduction of memory and computations; using algebraic formalism for algorithm development and code generation; incorporating optimized FFT routines. Codes have been tested on several hardware platforms, both single and multiple CPU's.

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Document Details

Document Type
Technical Report
Publication Date
Dec 15, 1996
Accession Number
ADA329533

Entities

People

  • J. Byrnes
  • J. Weiß
  • M. An
  • R. Tolimieri

Tags

Communities of Interest

  • Advanced Electronics
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Algorithms
  • Capacitance
  • Computational Complexity
  • Computations
  • Decomposition
  • Diffusion
  • Digital Signal Processing
  • Equations
  • Galerkin Method
  • Heat Energy
  • Multichip Modules
  • Reliability
  • Signal Processing
  • Symmetry
  • Test And Evaluation
  • Three Dimensional
  • Two Dimensional

Readers

  • Computational Fluid Dynamics (CFD)
  • Database Systems and Applications
  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)