Morphology of Gold and Copper Ion-Plated Coatings

Abstract

Copper and gold films (0. 2 to 2 micron thick) were ion plated onto polished 304-stainless-steel, glass, and mica surfaces. These coatings were examined by SEM for defects in their morphological growth. Three types of defects were distinguished: nodular growth, abnormal or runaway growth, and spits. The cause for each type of defect was investigated. Nodular growth is due to inherent substrate microdefects, abnormal or runaway growth is due to external surface inclusions, and spits are due to nonuniform evaporation (ejection of droplets). All these defects induce stresses and produce porosity in the coatings and thus weaken their mechanical properties. During surface rubbing, large nodules are pulled out, leaving vacancies in the coatings.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1978
Accession Number
ADA330159

Entities

People

  • Talivaldis Spalvins

Organizations

  • Glenn Research Center

Tags

DTIC Thesaurus Topics

  • Chemical Etching
  • Coatings
  • Diameters
  • Direct Current
  • Electron Microscopy
  • Etching
  • Evaporation
  • Films
  • Finishes
  • Glow Discharges
  • Materials
  • Mechanical Properties
  • Microscopes
  • Scanning Electron Microscopy
  • Stainless Steel
  • Substrates
  • Surface Roughness

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.