Stress/Failure Analysis Software for Multi-Material Interfaces

Abstract

An advanced capability for the evaluation of the mechanical strength of electronic components subjected to thermal and mechanical loading in two dimensions has been developed. The implementation is based on recent technological advances which make it possible to determine the natural straining modes and their intensities at singular points associated with multi-material interfaces numerically with a high degree of reliability. The computational techniques were implemented in a two dimensional setting as a module within the existing finite element analysis program of Stress Check. Stress Check is based on the p and hp versions of the finite element method and has several innovative capabilities, not available in other finite element programs. The feasibility of an analogous algorithm for the computation of the eigenpairs that characterize the temperature and displacement fields in the vicinity of singularities caused by multi-material interfaces in three dimensions was established.

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Document Details

Document Type
Technical Report
Publication Date
Dec 12, 1996
Accession Number
ADA332204

Entities

People

  • Ricardo L. Actis

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Composite Materials
  • Computations
  • Coordinate Systems
  • Differential Equations
  • Eigenvalues
  • Finite Element Analysis
  • Fracture (Mechanics)
  • Geometry
  • Heat Transfer
  • Intensity
  • Materials
  • Mathematical Analysis
  • Mechanics
  • Stress Intensity Factors
  • Thermal Stresses
  • Three Dimensional
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)
  • Software Engineering
  • Structural Dynamics.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems