Stability and Thermal Influences in Continuum Mechanics and Materials Science

Abstract

Work continued on order parameter theories of two-phase continua. This work differs from past work in the introduction a balance law for microforces associated with the kinematics of the order parameter and the use of the second-law to develop constitutive equations. A general framework for dynamical fracture is developed based on the notion of configurational forces in conjunction with a mechanical version of the second law. Here, as with other work done on this project, configurational forces are viewed as basic objects consistent with their own force balance. This balance yields a kinetic relation for the evolution of straight cracks. Kinking and curving of cracks is based on the requirement that the crack propagate in the direction that maximizes the energy dissipatation. Explicit relations for the initial kink angle and the subsequent direction of propagation are given. A continuum framework is developed for recrystallization. The driving force is the energy stored in dislocation substructures, characterized with the aid of a scalar measure, the dislocation content. A relation is obtained characterizing the efficiency with which dislocation substructure is eliminated by moving grain boundaries.

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Document Details

Document Type
Technical Report
Publication Date
Aug 25, 1997
Accession Number
ADA332571

Entities

People

  • Morton E. Gurtin

Organizations

  • Carnegie Mellon University

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Constitutive Equations
  • Differential Equations
  • Electromagnetic Fields
  • Electromagnetism
  • Energy
  • Equations
  • Equations Of State
  • Grain Boundaries
  • Kinematics
  • Materials
  • Materials Science
  • Mechanics
  • Partial Differential Equations
  • Personal Information Managers
  • Phase Transformations
  • Thermodynamics
  • Transitions

Readers

  • Fluid Dynamics.
  • Materials Science (Mechanical Engineering).
  • Materials Science and Engineering.