Microlithographic Mask Development (MMD)

Abstract

The primary goal throughout the Option 2 contract period was to eliminate the gold absorber process and implement a refractory metal process. With the initial transition completed, in which all mask patterning processes have been implemented within the MMD, the focus is currently on implementing all substrate fabrication steps within the MMD as well. This has resulted in the purchase and installation of some major equipment. In addition, our goal of developing processes for 130nm and below continues, and has also resulted in major equipment purchases and process changes. At the same time, we have been working on several important product demonstration masks for various customers.

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Document Details

Document Type
Technical Report
Publication Date
Dec 22, 1997
Accession Number
ADA334393

Entities

Organizations

  • Lockheed Martin

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Assembly
  • C Programming Language
  • Chemistry
  • Computer Programming
  • Computer Programs
  • Computers
  • Fabrication
  • Light Sources
  • Mainframe Computers
  • Manufacturing
  • Materials
  • Measurement
  • Refractory Metals
  • Silicon Carbide
  • Surface Roughness
  • Test And Evaluation

Readers

  • Nanofabrication and Microfabrication.
  • Software Engineering