Reactive Compatibilization in Immiscible Polymer Blends

Abstract

There has been considerable interest in recent years in the development of novel polymeric materials through blending rather than through development of new chemical structures. Blending may be chosen for several reasons, for example, tailoring properties to meet a specific need or simplifying recycling efforts by reducing separation procedures. Development of useful blends is challenged by the inherent immiscibility of most polymers with one another, which results in coarsely phase separated polymer mixtures in which the interphase interfaces are compositionally sharp and mechanically weak. Recent research efforts have concentrated on microstructural control through reactive compatibilization, a procedure in which functional groups are incorporated onto the polymer chains of the blend components and react during the processing to form copolymers that stabilize the dispersion. While some effort has been directed at understanding the relationship between reactivity and morphology, study of the effects of in-situ copolymer formation on the adhesion of interphase interfaces has been neglected. It is the purpose of this investigation to concentrate on both aspects of reactive compatibilization, morphology refinement and interphase adhesion.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1994
Accession Number
ADA334673

Entities

People

  • Nora C. Tan

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Alkenes
  • Biomedical And Dental Materials
  • Block Copolymers
  • Chemical Synthesis
  • Chemistry
  • Copolymers
  • Elastic Properties
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Mechanical Properties
  • Mechanical Working
  • Mechanics
  • Modulus Of Elasticity
  • Organic Chemistry
  • Polymer Chemistry
  • Polymeric Films

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Theoretical Analysis.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics