JPRS Report, Science and Technology Japan, 3rd Microelectronics Symposium

Abstract

PARTIAL CONTENTS; Activated Metal Junction Technology for AlN/Cu System High Power Module Substrate; Application of Aluminum Nitride to Large Electric Power Insulating Substrate; Degree of Sintering, Thermal Conductivity of Aluminum Nitride Ultrafine Particles; Effect of Baking Pressure on AlN Sintering; Thick Film Resistor for Use in AlN Ceramics.

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Document Details

Document Type
Technical Report
Publication Date
Apr 20, 1990
Accession Number
ADA336241

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Reactions
  • Chemistry
  • Composite Materials
  • Critical Temperature
  • Crystals
  • Electromagnetic Fields
  • Film Resistors
  • Heat Energy
  • Materials
  • Measurement
  • Nanoparticles
  • Particle Size
  • Particles
  • Physical Properties
  • Refractory Metals
  • Softening Point
  • Thermal Conductivity

Fields of Study

  • Physics

Readers

  • Thermal Physics or Thermal Science.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene