Damage Modes and Mechanisms of Si-Ge Films Under Prompt Soft X-Ray Radiation
Abstract
Thermal and residual stresses in films exposed to sudden temperature changes are analyzed based on an elastoplastic brittle idealization of film response. The results thus obtained are used to explain qualitatively the damage mechanisms of various failure modes observed in Si-Ge film deposited on a single crystal Si substrate exposed to soft x-ray radiation for a short duration of time.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 13, 1992
- Accession Number
- ADA338675
Entities
People
- Dick J. Chang
- Rokuro Muki
- Sandra R. Gyetvay
Organizations
- The Aerospace Corporation