A Technique to Ease the Fabrication Tolerance of Integrated Optical Power Splitters
Abstract
Fabrication tolerances and sidewall scattering losses in self imaging waveguide devices are ameliorated by a partial etch fabrication technique. Using a modal decomposition model, we find that the self imaging plane's depth of focus increases with a reduction in etch depth. A broad depth of focus in the self image plane relaxes the fabrication tolerance of the device's critical width dimension for a specified device performance. Trade offs for this increased depth of focus include a modest increase in device length and a slight reduction in peak coupling efficiency.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1998
- Accession Number
- ADA339946
Entities
People
- David M. Mackie
- Tristan J. Tayag
Organizations
- United States Army Research Laboratory