High Temperature Superconductor MCM Process Development
Abstract
Two types of high-temperature superconducting (HTS) multichip modules (MCMs) utilizing yttrium-barium-copper oxide (YBCO) as the superconductor, were developed under this grant. The first was a "flip mesh" MCM, in which two superconducting layers, one containing X-running and one Y-running wire segments, were fabricated on separate substrates and joined in a manner similar to flip chips. The second module was a monolithic MCM, again using layers of X- and Y-running conductors, but patterned on a single substrate, with a thick layer of SiO2 serving as interlayer dielectric. Deposition of the second superconducting (YBCO) layer was effected by the use of an ion beam-assisted deposition (IBAD) buffer layer.
Document Details
- Document Type
- Technical Report
- Publication Date
- Mar 18, 1998
- Accession Number
- ADA339986
Entities
People
- Leonard W. Schaper
Organizations
- University of Arkansas