Design for Packageability; Early Consideration of Packaging from a Microelectronic System Designer's Viewpoint

Abstract

The goal of this project was to assist in globally optimizing the design of higher performing microelectronic systems by incorporating critical packaging factors into the IC design flow. More specifically, our work was intended to empower system designers, especially designers of multi-million transistor ICs, to obtain optimized MCM-based systems.

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1998
Accession Number
ADA344340

Entities

People

  • Donald W. Bouldin

Organizations

  • University of Tennessee system

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Circuit Boards
  • Computer-Aided Design
  • Computers
  • Electrical Engineering
  • Electronics
  • Fabrication
  • Instruction Set Architecture
  • Integrated Circuits
  • Mainframe Computers
  • Military Research
  • Printed Circuits
  • Reliability
  • Test Methods
  • Three Dimensional
  • Transistors
  • Two Dimensional
  • Very Large Scale Integration

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Systems Analysis and Design

Technology Areas

  • Microelectronics