Tri-Service Environmental Stress Screening Guidelines.

Abstract

Environmental stress screening (ESS) is a cost-effective means of improving quality and reliability of electrical, electronic, electrooptical, electromechanical and electrochemical assemblies and systems at a time when defect removal is relatively inexpensive. This document provides guidance for implementing the ESS requirements in Part 6, Section C, Paragraph 3f(l) of DOD Instruction SOOO.2 dated 23 February 1991. It will help program managers, project engineers, and contracting officers implement a successful ESS program. It explains to management the benefits of ESS, and when and how to implement it, and conveys ESS fundamentals, planning and execution to engineers. It focuses on ESS in development, production and overhaul, at levels of assembly from the printed wiring assembly to the system. ESS of parts is covered in other publications. Random vibration and temperature cycling have proven to be the most successful forms of ESS in terms of effective flaw precipitation. The focus of these guidelines is on these forms, and an acceptable methodology for each is detailed herein and recommended for use. Other forms of ESS which may prove effective for specific hardware configurations and characteristics will require approval by the procuring agency.

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1993
Accession Number
ADA345831

Entities

Organizations

  • United States Department of Defense

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Climate Change
  • Closed Loop Systems
  • Computer Simulations
  • Contractors
  • Contracts
  • Data Acquisition
  • Data Analysis
  • Ecology
  • Electronic Components
  • Engineers
  • Failure Mode And Effect Analysis
  • Heat Transfer
  • Manufacturing
  • Materials
  • Temperature Gradients
  • Test Equipment

Readers

  • Software Engineering

Technology Areas

  • Microelectronics