Thermal Stresses 97: Proceedings of the Second International Symposium on Thermal Stresses and Related Topics.
Abstract
The International conference brings together experts from across the world. It promises to advance the theoretical underpinnings of this important technological area, improve our collective ability to analyze stress in engineered systems, advance our capability to design systems, structures, and products. The world has long depended on collaboration among members of the technical community. RIT values such international cooperation and is proud to play a role in the planning and implementation of this special symposium. The objective of Thermal Stresses 97 is to provided a forum for engineers and scientists engaged in industrial applications and basic research in the field of thermal stresses to exchange ideas and to extend further cooperation among the participants. The Thermal Stresses 97 enables engineers and researchers to meet at one place to present papers and conduct discussions. An extensive proceedings volume will be published. It will consist of 4-page extended abstracts of the papers submitted. The full text of papers will be published in...Journals on Mechanics", and in particular in the "Journal of Thermal Stresses".
Document Details
- Document Type
- Technical Report
- Publication Date
- Jun 11, 1997
- Accession Number
- ADA346402
Entities
People
- Richard B. Hetnarski
Organizations
- Rochester Institute of Technology