JPRS Report, Science & Technology, Japan. Die Cam System Function Specifications

Abstract

In our work on die CAD systems, we sought to come up with the ideal CAD system. If in like manner we seek to define a die CAM system so that it has a consistent content as a CAD/CAM system, then we should naturally arrive at a clear picture of what the future CAM system will be. As we began our work, we were aware of the close relationship between CAM and any die production system, so, keeping FA (factory automation) and CIM (computer integrated manufacturing) clearly in view, we came up with the following two guidelines, giving due consideration to information and material flows. (1) Our research would cover everything up to the preparatory manufacturing stages for processing/machining, assembly, and inspection, but would not deal with the actual processing/machining procedures themselves. (2) Our research would not deal with such production management operations as production planning or procedure control. In carrying on this research, as when doing the die CAD system research, we held meetings several times a year, making it necessary to limit our scope to die CAM. By formulating a clear picture of future die CAD/CAM systems, however, we have sought to isolate development tasks and problems, and to identify relationships with peripheral and related technologies. We also think that we have dispelled some of the mist that has shrouded predictions of when such a system will be realized.

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Document Details

Document Type
Technical Report
Publication Date
Nov 06, 1989
Accession Number
ADA347856

Entities

People

  • Hiroshi Sekiguchi
  • Kuniko Inoue

Organizations

  • Joint Publications Research Service

Tags

Communities of Interest

  • Air Platforms
  • Autonomy

DTIC Thesaurus Topics

  • Artificial Intelligence
  • Computer Programming
  • Cost Estimates
  • End Mill
  • Fabrication
  • Machine Tools
  • Manufacturing
  • Materials
  • Measurement
  • Measuring Instruments
  • Mechanical Engineering
  • Processing Equipment
  • Production
  • Surface Properties
  • Surface Roughness
  • Thermal Conductivity
  • Three Dimensional

Readers

  • Integrated Circuit Design and Technology.
  • Manufacturing Engineering.
  • Theoretical Analysis.