Display Ruggedization for Military Applications Using Automotive-Grade Active Matrix Liquid Crystal Displays.
Abstract
This report discusses the results of a Honeywell Technology Center program focused on developing thermal management methodologies and flip-chip-on-glass (FCOG) driver bonding techniques which are key to ruggedizing automotive-grade commercial off-the-shelf (COTS) active matrix liquid crystal displays (AMLCD) for use in military applications like the F-16 high-performance fighter environment. Through extensive thermal modeling, several techniques were identified to facilitate heat flow away from the temperature-sensitive liquid crystal material, keeping the core temperature within acceptable operating limits (below +85 C) in worse case conditions (200 fL with +50C ambient and 883Watts/mA2 solar load in a closed cockpit) without the use of forced air cooling for display sizes up to 5x5-inch. Environmental testing on eight modified Sharp displays verified modeling results. The FCOG bonding has many mherent advantages over traditional tape automated bonding (TAB) techniques, one of which is 75% reduction in off-glass interconnect density, making them much less susceptible to vibration failure. Several FCOG bonding materials (e.g., anisotropic conductive films) have been explored and tested using various test vehicles and subjected to F-16 environmental conditions for temperature shock, temperature cycling, vibration, and humidity.
Document Details
- Document Type
- Technical Report
- Publication Date
- May 01, 1998
- Accession Number
- ADA349440
Entities
People
- James B. Armstrong
- James M. Henz
- Sonia R. Dodd
Organizations
- Honeywell International, Inc.