An Expert System for Design of Plastic Integrated Circuit Packages Against Latent Moisture Induced Defects. Phase II

Abstract

This program examined the feasibility of developing a model for predicting cracking of plastic integrated circuit packages. It was demonstrated that moisture induced hydro-thermal stresses during soldering operations can cause plastic package cracking or "pop coming." A crack propagation model was developed using fracture mechanics parameters coupled with hydrostatic stresses. Selected plastic packages were characterized using the developed model and segregated according to crack susceptibility during a solder reflow process. Model results compared favorably with laboratory testing on actual parts. Also developed was a computer based expert system that incorporates the crack prediction model.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1998
Accession Number
ADA349682

Entities

People

  • An-yu Kuo
  • Kuan-luen Chen
  • Luu T. Nguyen

Tags

Communities of Interest

  • Advanced Electronics
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Air Force
  • Body Weight
  • Computational Fluid Dynamics
  • Computer Programs
  • Computer-Aided Design
  • Computers
  • Crack Propagation
  • Elastic Properties
  • Finite Element Analysis
  • Fluid Dynamics
  • Heat Transfer
  • Mechanical Properties
  • Mechanics
  • Operating Systems
  • Stresses
  • Thermodynamics
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Materials Science (Mechanical Engineering).
  • Software Engineering