Avionics Composite Evaluation
Abstract
Designers of electronic systems for current and next generation missiles systems are placing more emphasis on reduced weight, increased functionality and improved reliability. With the advent of large scale integration and multi-chip modules, packaging engineers are rapidly reaching a point where more electronic components can be integrated into electronic systems than what can be effectively cooled by traditional metal materials. This has resulted in the development of an increasing number of new composite materials that can provide improvements over conventional packaging materials. These improvements include better thermal management, higher strength and stiffness, and significant weight savings. One composite material constituent being investigated to address these future requirements is high modulus pitched-based graphite fibers. These fibers exhibit thermal conductivity of up to three times that of copper in the fiber direction, are light weight and have a very low coefficient of thermal expansion (CTE). These fibers can be combined with a number of different matrix materials such as polymers and metals, depending on the specific application. This paper focuses on the implementation of high modulus pitch-based graphite composites into two areas of missile avionics, chassis covers and printed wiring board (PWB) thermal plane/constraining cores. For these two applications, a significant weight savings was realized, thermal performance improved and mechanical integrity maintained by replacing aluminum with pitch-based graphite fiber reinforced organic matrix composites.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1998
- Accession Number
- ADA355840
Entities
People
- B. J. Sullivan
- J. C. Houston