Technology Development for Multilayered Microwave and Millimeter Wave Integrated Circuits
Abstract
During the last three years of research we have contributed to the technology development for multilayer microwave/millimeter wave integrated circuits (multilayer MMICs) of the future. Such multilevel integration would allow implementation of smaller sized, higher density, and multi-functional microwave/millimeter wave circuits and systems, that are more reliable and cost effective. Specifically, we have (1) investigated new transmission media that are better suited for multilayer integration, where conventional techniques may not work properly, (2) developed novel geometries for efficient signal transition between circuit layers in a multilayer environment, (3) developed new antenna and feeding structures that are specifically meant to work with multilayer integration, and (4) developed new theory and analytical/computational models for the design of transmission lines, layer to layer coupling structures. multilayer antenna feeds, which will greatly support the future development of the multilayer MMIC technology. Our research shows, that there are several fundamental and technological issues that must be carefully considered to advance the multilayer microwave/millimeter wave integration concept. However, by using new techniques and devices, such as those developed by us, much more sophisticated and cost effective circuits and systems can be built to meet the future demands in radar and wireless telecommunication.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 31, 1998
- Accession Number
- ADA357789
Entities
People
- D. M. Bolle
- N. K. Das