3-D Diamond MCM Technology Development Program
Abstract
3-D Diamond MCMs is an enabling technology to support chip-to-chip and module-to-module high<density connectivity and thermal management. The extremely high conductivity of diamond, coupled with its electrically insulating nature, makes it an ideal choice for solving 3-D packaging problems. The thermal conductivity is so high as to allow over 80 W/cu in of power dissipation to be extracted from a stack of diamond substrates by lateral thermal conduction techniques alone. Diamond laterally conducts the heat generated by the logic out of the "battle zone" of the actively populated 3-D stack of MCMs. This frees the designer to fully utilize all of the space between boards to implement a high area density array of vertical z-axis interconnects between all adjacent boards in the stack to minimize interconnect delays. This report summarizes the design, fabrication, integration and testing of a Demonstration Test Bed that was utilized as a tool for testing and demonstrating the thermal management capability of diamond MCMs. A signal integrity analysis was also performed to illustrate the high speed signal viability through the z-axis 3-D interconnect structure itself. Supporting system design details, photographs of fabricated components and subsystems, and test results are provided.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 30, 1998
- Accession Number
- ADA359076
Entities
People
- Dean A. Schaefer