Packaging and Cooling Considerations for Cryogenic Operation of Microprocessors
Abstract
This report contains a compilation of requirements and challenges for the cryogenic packaging of computer processors. A brief discussion of computer processing speed enhancements from sub-ambient cooling is included for use in cost/benefit analysis. A thermal analysis is presented which estimates the required cooling capacity needed for operation of microprocessors at sub-ambient temperatures over the range of from 40 deg C to 77 Kelvins. An analysis of electrical interconnection heat load is presented which concludes that this is the key challenge for the efficient design of sub-ambient computer systems, since reduction in heat load must be balanced with electrical impedance requirements, and the number of interconnections is quite large.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 15, 1999
- Accession Number
- ADA359134
Entities
People
- Barry Penswick
- Jonathan P. Knauth