Stress/Failure Analysis Software for Multi-Material Interfaces

Abstract

The objective of the project was to provide means for establishing reliable quantitative failure initiation criteria for multiple chip modules (MCMs), electronic packages, laminated composites and adhesively bonded joints. During Phase I, an easy-to-use, reliable and robust software was developed, with a graphic user interface, based on the innovative methods for the computation of generalized flux/stress/thermal intensity factors (GFIFs/GSIFs/ TSIFs) and the strength of the singularities for any multi-material interface problem involving isotropic or anisotropic materials, subject either to mechanical or thermal loading, in a two-dimensional setting. The existing software product Stress Check provided the framework for this development. Stress Check is based on the p- and hp-version of the finite element method, capable of a-posteriori error estimation in terms of the data of interest.

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Document Details

Document Type
Technical Report
Publication Date
Dec 06, 1996
Accession Number
ADA360535

Entities

People

  • Ricardo L. Actis

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Asymptotic Series
  • Composite Materials
  • Computations
  • Coordinate Systems
  • Differential Equations
  • Eigenvalues
  • Eigenvectors
  • Equations
  • Finite Element Analysis
  • Fracture (Mechanics)
  • Geometry
  • Heat Transfer
  • Mechanics
  • Stress Intensity Factors
  • Thermal Stresses
  • Three Dimensional
  • Two Dimensional

Fields of Study

  • Engineering

Readers

  • Database Systems and Applications
  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems