Full-Scale Test Evaluation of Aircraft Fuel Fire Burnthrough Resistance Improvements

Abstract

This report summarizes the research and full-scale tests undertaken by the Federal Aviation Administration (FAA) to evaluate the fuselage burnthrough resistance of transport category aircraft that are exposed to large postcrash fuel fires. Twenty-eight full-scale tests were conducted in a reusable fuselage test rig to determine the effectiveness of thermal-acoustical insulation improvements in preventing or delaying fuselage burnthrough. The testing showed that the method of attaching the insulation to the fuselage structure had a critical effect on the effectiveness of the insulation material. In addition, the composition of the insulation bagging material, normally a thermoplastic film, was also shown to be an important factor. A number of fiberglass insulation modifications and new insulation materials were shown to be effective in varying degrees. For example, a heat-treated, oxidized polyacrylonitrile fiber (OPF) encased in a polyimide bagging material prevented burnthrough for over 8 minutes. When contrasted with current insulation materials, which were shown to fail in as little as 2 minutes, effective fire barriers such as the OPF insulation offer the potential of saving lives during a postcrash fire accident in which the fuselage remains intact.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1999
Accession Number
ADA360550

Entities

People

  • Timothy R. Marker

Tags

Communities of Interest

  • Air Platforms
  • Human Systems

DTIC Thesaurus Topics

  • Accidents
  • Aircraft Cabins
  • Aircrafts
  • Airframes
  • Cargo Aircraft
  • Ceramic Fibers
  • Combustion
  • Composite Materials
  • Films
  • Fire Safety
  • Fires
  • Fuselages
  • Materials Laboratories
  • Materials Processing
  • Military Aircraft
  • Polymer Matrix Composites
  • Transport Aircraft

Readers

  • Fire Suppression Systems Design.
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems