Separation of Carrier Lifetime from Interface Recombination Velocity

Abstract

The semiconductor manufacturing industry always needs faster, non-invasive means to establish the electrical quality of wafers and processes. Methods to measure and map the quality of full wafers on a routine basis permits faster feedback and identification of problems. Such techniques form a growing part of the statistical Quality Control/Quality Assessment (QC/QA) algorithms of the modern manufacturing process.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1997
Accession Number
ADA360748

Entities

People

  • John L. Freeouf

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Gaps
  • Compound Semiconductors
  • Computers
  • Conductivity
  • Dye Lasers
  • Equations
  • Films
  • Lasers
  • Light Sources
  • Materials
  • Measurement
  • Renewable Energy
  • Silicon Carbide
  • Simulations
  • Standards
  • Thin Films
  • Two Dimensional

Readers

  • Facility/Structural Engineering.
  • Industrial Economics
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics