Thermal and Electro-Thermal Modeling and Simulation Techniques for Multichip Modules.

Abstract

This report results from a contract tasking Technical University of Budapest Department of Electron Devices as follows: The contractor will investigate the issues and problems of coupled electro-thermal M&S of Mixed Technology Multichip Modules (MT-MCMs). MT-MCMs for this project will be defined as a mixtures of high performance computing, microelectromechanical systems, and microfluidic systems. The use of M&S will be investigated for each of the generic steps of the design process flow as shown in the proposal. The contractor will determine the most cost effective M&S approach for each step in the design process. The possibilities of integrating the existing fast and accurate design tools of TUB into the AFRL design flow have to be investigated, and the optimal M&S approach determined.

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Document Details

Document Type
Technical Report
Publication Date
Dec 10, 1998
Accession Number
ADA361147

Entities

People

  • Istvanne Kerecsen
  • Marta K. Rencz
  • Vladimir Szekely

Organizations

  • Budapest University of Technology and Economics

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Beam Leads
  • Computational Fluid Dynamics
  • Differential Equations
  • Electronic Circuits
  • Equations
  • Fluid Flow
  • Frequency Domain
  • Heat Transfer
  • High Performance Computing
  • Microelectromechanical Systems
  • Microelectronics
  • Multichip Modules
  • Simulations
  • Simulators
  • Thermal Conductivity
  • Three Dimensional
  • Two Dimensional

Readers

  • Enterprise Information Systems Architecture and Joint Command Capability Interoperability Support.
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics