Channel Constrained Metalization Patterning of Reflective Backplane Electrodes for Liquid Crystal-on-Silicon Displays

Abstract

Channel Constrained Metalization (CCM), which employs photoresist patterning to confine electroless metal deposition to selected regions, is an inexpensive alternative to metal sputtering or evaporation. Using CCM we deposited arrays of square nickel electrodes up to one micron in thickness and between 11 microns and 44 microns on the side. Gaps between the electrodes ranging from 1 micron to 4 microns were successfully patterned. In preliminary experiments, we have already achieved a reflectivity of up to 94% and an r.m.s. surface roughness of 3.3 nm evaluated on a pixel size (20 micron square) area.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1997
Accession Number
ADA361352

Entities

People

  • Anno Hermanns
  • Catherine O'ferrall
  • Jeffrey Calvert
  • Mu-san Chen
  • Walter Dressick

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Capital Investments
  • Carrier Mobility
  • Catalysts
  • Covalent Bonds
  • Crystals
  • Electrodes
  • Electroless Plating
  • High Resolution
  • Liquid Crystals
  • Low Temperature
  • Military Research
  • Particle Size
  • Plating
  • Roughness
  • Self Assembled Monolayers
  • Substrates
  • Surface Roughness

Readers

  • Integrated Circuit Design and Technology.
  • Optical Physics and Photonics.
  • Surface Engineering/Surface Coating Technology.