Nonintrusive System for Replication of interlayer Printed Circuit Patterns

Abstract

Report developed under SBIR contract. The overall objective of this Phase I research program was to develop a nonintrusive method to image the art work of interlayer printed circuit board. Using forward Compton scattering and innovative design of a high-efficiency and high-resolution ring-slit Compton scattering camera, we have both theoretically demonstrated and experimentally verified the feasibility of reverse engineering the circuit board. An algorithm using 2-D projection and Compton scattering data was proposed for image reconstruction of the layout of the printed circuit board, layer by layer. This algorithm is highly efficient, less computational, straightforward, and easy to implement.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1998
Accession Number
ADA362070

Entities

People

  • A. Chau
  • M. Chai

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Algorithms
  • Backscattering
  • Circuit Boards
  • Circuits
  • Compton Scattering
  • Data Acquisition
  • Detectors
  • High Resolution
  • Image Processing
  • Image Reconstruction
  • Printed Circuit Boards
  • Printed Circuits
  • Scattering
  • Scintillation Counters
  • Test Equipment
  • Two Dimensional

Fields of Study

  • Physics

Readers

  • Computer Vision.
  • Fluid Mechanics and Fluid Dynamics.
  • Software Engineering