A Preliminary Investigation of the Interfacial and Dielectric Properties of Polyhedral Oligomeric Silsesquioxane Polymer Blends

Abstract

The interfacial tension and dielectric properties of Polyhedral Oligomeric Silsesquioxane (POSS) have been investigated. POSS end-capping of a semiflexible liquid crystalline polymer lowers the interfacial tension between the parent liquid crystalline polymer (LCP) and poly(dimethyl siloxane) PDMS. The interfacial tension lowered with time, most likely because of POSS segragation to the LCP/PDMS interface. The dielectric properties of POSS compounds in the X-band region were measured. POSS appears to generally raise the dielectric constant while not impacting the loss tangent. POSS compounds were also seen to have higher hardness than the non-POSS resin.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1998
Accession Number
ADA362369

Entities

People

  • Kevin P. Chaffee
  • Patrick T. Mather

Organizations

  • Air Force Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force Research Laboratories
  • Copolymers
  • Dielectric Permittivity
  • Dielectric Properties
  • Geometry
  • Material Degradation Processes
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Mechanical Properties
  • Mechanics
  • Nanocomposites
  • Polymer Degradation
  • Polymers
  • Resins
  • Surface Tension

Fields of Study

  • Materials science

Readers

  • Microwave Engineering.
  • Polymer Science and Technology