High-Performance Liquid Crystal Adhesives
Abstract
High-temperature, easy-to-process adhesives are needed for adhesively bonded joints, and composite patch repair. Resins, such as epoxies, that are currently used are processable at temperatures below 200 deg C but have low upper-use temperatures. High-performance polyimides can be used at temperatures exceeding 300 deg C, but must be processed above 300 deg C. Low processing temperatures are needed for easy field repair as well as cost effective manufacturing processes. It is most desirable to have materials that are both easy to process and have high thermal stability. A high-temperature, low-shrinkage, easy-to-process adhesive based on liquid crystal monomers with reactive end groups was developed and evaluated in this program. In addition, an integrated fiber sensor for sensing moisture in the adhesive was investigated. During the Phase I effort a high-performance liquid crystal monomer was synthesized and a fiber optic moisture sensor was demonstrated. The liquid crystal monomer was evaluated and showed thermal stability up to 300 deg C with curing below 150 deg C. A Phase II proposal has been submitted focusing on further development and characterization of the adhesive material.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 22, 1999
- Accession Number
- ADA363644
Entities
People
- Patrick J. Hood
Organizations
- Cornerstone Research Group