Reliable Application of Plastic Encapsulated Microcircuits; RAC Parts Seclection, Application and Control Series

Abstract

This report summarizes and analyzes the issues relating to Plastic Encapsulated Microcircuit (PEM) Reliability. Included is: (1) discussion of current research efforts within the government and industry, (2) failure modes and mechanisms associated with PEMs, (3) test data on PEMs subjected to HAST, life test, Autoclave, high temperature storage, 85 deg C/85%RH tests, (4) field reliability data, (5) analysis of both test data and field data, (6) a reliability assessment model derived from the data and (7) conclusions regarding the selection and applications of PEMs.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1996
Accession Number
ADA363879

Entities

People

  • David P. Nicholls
  • John Farrell
  • William Denson

Tags

Communities of Interest

  • Advanced Electronics
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Ceramic Materials
  • Databases
  • Electronic Components
  • Electronics Industry
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Life Tests
  • Material Degradation Processes
  • Materials
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanics
  • Reliability
  • Semiconductor Devices
  • Test And Evaluation
  • Test Methods

Readers

  • Electronics Engineering
  • Polymer Science and Engineering.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics