Robust 300 Degree C Wire Insulation System
Abstract
The objective was to develop an advanced wire insulation system having improved electrical and thermal properties over the state-of-the-art Kapton(registered) based systems for applications in future generation spacecraft or aircraft. The program focused on using PFPI and PFE-285 films with AFR700B and FM680-1 polyimides as adhesives to bond film layers. An are commercially available and reported to possess excellent electrical and thermal properties. A test matrix was conducted on these film/adhesive candidates and the PFPI/AFR700B was selected as the most promising insulation system. Substantial exploratory work was performed to define the process parameters for manufacturing the insulated conductor wire. The process steps involve: (1) casting PFPI film from solution, (2) spray-coated with AFR700B with a solution diluted with methanol, (3) coated film was slit and spliced into continuous tape, (4) coated tapes were wrapped onto a 20 AWG nickel-plated strand wire, and (5) final cure. Results from this development program indicate that substantially more effort is necessary to yield a truly superior polymeric dielectric insulation film material. Exploratory work is needed to modify molecular structure of PFPI by extending the mean molecular weight to improve its flexibility while retaining its high temperature dielectric properties and resistance to thermal oxidative environment.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 01, 1998
- Accession Number
- ADA367152
Entities
People
- Robert J. Jones
- Wing C. Wong