Inductive Plasma Physical Vapor Deposition for Shape Memory Alloys
Abstract
This work sought to use inductive thermal plasmas to deposit superelastic alloys from a wire source. It was found that unbiased sources could not be heated sufficiently at the tip to produce a measurable deposition rate. NiTi and Cu films were deposited at very low rates (on the order of 10 nm/min) using roughly 200 VDC applied to the wire relative to the substrate. Thermal modeling suggests that pulse biasing is necessary to achieve high deposition rates.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 19, 1999
- Accession Number
- ADA367685
Entities
People
- Daniel M. Dobkin
- Simon I. Selitser