Inkjet Printing of Flexible Circuits on Polymer Substrate

Abstract

Flexible printed circuits have a wide range of applications in consumer electronics, computers, automobiles, and space and aerospace vehicles. In this Small Business Technology Transfer (STTR) Phase 1 program, Materials Research Institute (MRI) and University of Dayton Research Institute (UDRI) demonstrated the feasibility of a new processing scheme leading toward the fabrication of high performance, low cost flexible circuits with computer aided design tools using the inkjet printing technology. Silver metal precursor solutions were studied for their viscosity and printability. Printed conductor patterns were evaluated on three commercially available polymer substrate materials. Research emphasis was focused on improving adhesion between the reduced conductor metal and the polymer substrate. Ag conductor patterns obtained from this processing scheme exhibited excellent electrical conductivity, mechanical integrity, and adhesion. This processing scheme is simple yet versatile. It can be readily extended to build multiple layer circuits as well as circuits on a contour surface.

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Document Details

Document Type
Technical Report
Publication Date
Nov 18, 1999
Accession Number
ADA371393

Entities

People

  • Chung-tse Chu

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Space

DTIC Thesaurus Topics

  • Adhesion
  • Aerospace Craft
  • Computers
  • Conductivity
  • Electrical Conductivity
  • Fabrication
  • Manufacturing
  • Materials
  • Materials Processing
  • Mechanical Properties
  • Polymeric Films
  • Printed Circuits
  • Printing
  • Small Business
  • Surface Tension
  • Technology Transfer
  • Viscosity

Fields of Study

  • Materials science

Readers

  • Microwave Engineering.
  • Nanocomposite Materials Science
  • Reinforced Composite Materials

Technology Areas

  • Microelectronics
  • Space