Dielectric Relaxation Spectroscopy of Adhesively Bonded Joints

Abstract

Prior to any microcracking or delamination in an adhesive bond, an aggressive hygrothermal environment can cause molecular level, chemical and/or physical changes to the adhesive itself. This program was aimed at identifying the changes in the adhesive by the non-destructive test technique known as dielectric relaxation spectroscopy. In addition to identifying the changes in the adhesive by non-destructive techniques, the program was also aimed at determining the changes in the mechanical properties of an adhesive joint resulting from different levels of environmental exposure. These results were then to be correlated to the results obtained by the dielectric spectroscopy technique.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1999
Accession Number
ADA371559

Entities

People

  • Naveen Rastogi
  • Patricia L. Stumpff
  • Rajesh K. Tiwari

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Destructive Tests
  • Environment
  • Environmental Exposure
  • Experimental Data
  • Failure Mode And Effect Analysis
  • Frequency Domain
  • Glass Transition Temperature
  • Infrared Spectroscopy
  • Materials
  • Mechanical Properties
  • Moisture Content
  • Relaxation Time
  • Spectroscopy
  • Stress Strain Relations
  • Stresses
  • Transition Temperature

Readers

  • Materials Science and Engineering.
  • Reinforced Composite Materials
  • Surface Coatings Technology.