Interface Formation and Solid-Solid Reactions Induced by Cluster Ion Deposition

Abstract

Development is reported of a unique phase-space-compressing ion deposition beamline, coupled to an ultrahigh vacuum surface preparation/analysis system. The performance of the beamline in low energy focused deposition is discussed. A system of transferrable, high precision sample holders is described. An embedded-atom code developed for simulation of the cluster impact behavior is described. Initial results are presented for deposition, sticking, and penetration of copper atoms and copper dimers impacting on molybdenum and nickel over a wide range of collision energies.

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Document Details

Document Type
Technical Report
Publication Date
Dec 16, 1999
Accession Number
ADA371853

Entities

People

  • Scott L. Anders

Organizations

  • University of Utah

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Auger Electrons
  • Chemistry
  • Desorption
  • Dynamics
  • Electrons
  • Energy
  • Films
  • High Energy
  • Ion Sources
  • Ions
  • Measurement
  • Photoelectrons
  • Picosecond Time
  • Spectra
  • Spectroscopy
  • Trajectories
  • X Rays

Fields of Study

  • Physics

Readers

  • Quantum Chemistry
  • Thin Film Deposition Science.

Technology Areas

  • Space
  • Space - Hall-Effect Thruster