Determination of the Mechanical Properties of Polycrystalline Silicon for MEMS

Abstract

The research supported under this grant was part of a multi-institution round-robin experiment to determine the elastic modulus and fracture strength of a common material used in microelectromechanical systems (MEMS). Research teams at four institution - Johns Hopkins University, California Institute of Technology, Experiment/Failure Analysis Associates and the University of California, Berkeley - designed unique devices for determining the material properties of interest. All four designs were then fabricated on using the Multi-User MEMS Processes (MUMPs) at MCNC, Research Triangle Park, NC. MUMPs is regularly scheduled polysilicons surface micromachining fabrication service. Specimens were produced on centimeter-square dies at adjacent locations on the wafers. The specimens tested were from the MUMPs 19 and MUMPs 21 runs. Following fabrication, the structures were released and tested at each individual facility. Results were compared at the Spring, 1998 meeting of the Materials Research Society, with the paper published in the MRS Proceedings Volume 518.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1999
Accession Number
ADA372431

Entities

People

  • George C. Johnson

Organizations

  • University of California, Berkeley

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • California
  • Cantilever Beams
  • Engineering
  • Fabrication
  • Failure Analysis
  • Manufacturing
  • Materials
  • Mechanical Properties
  • Microelectromechanical Systems
  • Micromachining
  • Modulus Of Elasticity
  • Polycrystals
  • Test Methods
  • Universities

Readers

  • Integrated Circuit Design and Technology.
  • Mechanical Engineering/Mechanics of Materials.
  • Research Science/Academic Research

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems