Accelerated Adhesive Curing for Induction-Based Repair of Composites

Abstract

A methodology for accelerated curing of commercially available room-temperature curing paste adhesives is outlined. Cure kinetics of the adhesive were studied by thermochemical analysis, and degree of cure was related to processing parameters and cure cycles. Increasing the cure temperature to 100 degrees C reduced the cure time from 16 hr to approximately 15 min. for 98% cure. Induction-heating techniques were used to demonstrate rapid heating of adhesives at the bondline for lap shear specimens.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1999
Accession Number
ADA372440

Entities

People

  • Bruce K. Fink
  • John W. Gillespie Jr.
  • Sean Wells
  • Shridhar Yarlagadda
  • Steven H. McKnight

Organizations

  • United States Army Research Laboratory

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Artillery
  • Chemical Kinetics
  • Composite Materials
  • Dynamics
  • Electromagnetic Radiation
  • Equations
  • Glass Transition Temperature
  • Heat Transmission
  • Heating
  • Induction Heating
  • Isotherms
  • Kinetics
  • Materials
  • Military Research
  • Surface Warfare
  • Warfare

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.
  • Reinforced Composite Materials