Interface Formation and the Adhesion of Deposited Thin Films

Abstract

A discussion is given of the types of interfacial regions which may be formed between a film and a substrate. Various deposition techniques are compared as to their ability to form the various types of interfacial regions. The mechanism of failure of the bond between film and substrate is discussed in terms of the type and structure of the interfacial region. The reasons for poor adhesion are discussed and approaches for overcoming adhesion problems are presented. The deposition process of "ion plating" is presented as one technique for overcoming many adhesion problems.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1965
Accession Number
ADA375746

Entities

People

  • D. M. Mattox

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Adhesion
  • Bonding
  • Chemical Reactions
  • Coatings
  • Failure Mode And Effect Analysis
  • High Energy
  • Intermetallic Compounds
  • Ion Bombardment
  • Materials
  • Materials Processing
  • Metals
  • Physical Properties
  • Sputtering
  • Substrates
  • Thickness
  • Thin Films
  • Vacuum Deposition

Readers

  • Ocean-Atmosphere Mesoscale Modeling, Data Assimilation, and Flux Boundary Layers
  • Surface Engineering/Surface Coating Technology.
  • Systems Analysis and Design