Analysis of Design of Mixed-Signal Electronic Packaging

Abstract

The objective of this project is to develop innovative algorithms and prototype tools that will help facilitate the design of mixed signal multi-chip modules and packaging in a manner that is similar to what is possible today for ICs. The proposed advances are considered on several fronts: (1) new algorithms and definitions for magnetic vector potentials which permit simplified inductance estimates for early phases of design; (2) Accurate 3-D inductance extraction algorithms that start with these inductance estimates and then adaptively grid the conductor materials as accuracy dictates; and (3) New automatic methods of model order reduction which generate provably passive, stable, and accurate representations of structures described by enormous large RLC (resistor-inductor-capacitor) circuits or discretized integral equations.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1999
Accession Number
ADA377820

Entities

People

  • Lawrence Pileggi

Organizations

  • Carnegie Mellon University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Accuracy
  • Algorithms
  • Circuits
  • Computer-Aided Design
  • Equations
  • Extraction
  • Frequency
  • Geometry
  • Inductance
  • Integral Equations
  • Integrals
  • Materials
  • Packaging
  • Semiconductors
  • Simulations
  • Students
  • Three Dimensional

Readers

  • Control Systems Engineering.
  • Distributed Systems and Data Platform Development
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems