High Thermal Conductivity Thermosets for Composite Applications

Abstract

A new class of discotic liquid crystal (DLC) epoxy resins have been developed which show a marginal degree of enhanced thermal transport properties compared to conventional, amorphous epoxy resins. The DLCs feature metallomesogen cores with various pendant flexible spacer groups, can be cured individually or as blends of different types of DLCs with a variety of aliphatic and aromatic polyamines at low temperatures (80 to 100 C) to give strong, semi-flexible films. The Z axis thermal conductivity values for these novel cured DLCs range between 0.24 and 0.30 W/m-K as compared to roughly 0.20 W/m-K for conventional epoxy resins.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
May 01, 2000
Accession Number
ADA378847

Entities

People

  • George Gould
  • Kang Lee

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Ground and Sea Platforms
  • Space

DTIC Thesaurus Topics

  • Alkanes
  • Alkenes
  • Chemical Synthesis
  • Chemistry
  • Composite Materials
  • Heat Energy
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Organic Chemistry
  • Phase Transformations
  • Resins
  • Test Methods
  • Thermal Conductivity
  • Transition Temperature

Fields of Study

  • Materials science

Readers

  • Polymer Science and Engineering.
  • Polymer Science and Technology
  • Thermal Physics or Thermal Science.